Key Responsibilities

• Conduct simulation projects, for flow, heat transfer, and chemistry/plasma phenomena in high Knudsen number (Kn 〉0.1) regime, using particle based (DSMC for rarefied gas dynamics, PIC-MCC for plasma) modeling tools. In particular, low pressure pumping flow and plasma in etch chambers, feature profile evolution due to etch / deposition process, surface process model development via molecular dynamics models, need to be covered
  

• Analyze the simulation results, and document with the useful findings that will guide the optimization of product design and process recipe
  

• Work with mechanical/process engineers to understand their issues, and explain the simulation findings and recommendation for improvement
  

  
  

Key Requirements

• PhD in plasma physics, surface chemistry, or related field, with particle based modeling experiences such as DSMC, etc.